TDS

Electronics Lab

Commercial prototype lab

Custom electronics, FPGA prototypes, and proper component choices.

We help clients choose the right components for real constraints: availability, electrical fit, firmware impact, layout risk, thermal behavior, and the prototype path to a reliable product.

FPGA

VHDL / Verilog / timing closure

ADC, DAC, LVDS-style, SPI, USB, Ethernet

POWER

PMIC, MOSFET, drivers, thermal checks

BOM

component choice, alternates, availability risk

R&D ProfileFPGA, embedded, analog, power, sensing

Design ModelCustom and on-demand engineering

Component ChoiceFit, availability, alternates, validation

01Schematic review

02Component selection

03Board bring-up

04Design notes

Lab plates

FPGA prototype validation bench with oscilloscope probes and ADC front-end board. — Primary plate / FPGA validation bench

Prototype work shown as engineering evidence, not decoration.

The image system now behaves like a technical sheet: a measured visual plate, a compact explanation, and a scannable proof list.

FPGA timing and acquisition validation
Custom board review and bring-up
Component selection and BOM risk review

Custom electronics board with schematic, probes, component trays, and calipers. — Design plate / schematic to prototype

DESIGN FIT

Custom work starts with the parts that shape the board.

Architecture, schematic decisions, enclosure limits, connectors, power paths, and test access are reviewed before the prototype becomes expensive to change.

Schematic and architecture review
Prototype layout constraints
Bring-up and revision planning

Electronic components arranged for selection and validation with probes and fixture board. — Component plate / selection and validation

BOM FIT

Parts are selected against real build constraints.

Each recommendation connects the component to the circuit role, firmware impact, layout risk, stock position, and bench checks needed for the next prototype.

Electrical fit and package constraints
Availability and second-source options
Test notes before a board spin

Design model

A tighter bridge between component choice and working hardware.

Components are selected inside realistic circuit decisions: layout risk, test access, timing, thermal behavior, firmware touchpoints, lifecycle, and availability.

Architecture review before committing to a part
Prototype layout and bring-up notes
Alternates and BOM notes for confident purchasing

Component decision capabilities

What we can choose with confidence

The lab is set up for practical component decisions: which part fits the design, what risks remain, and which alternate keeps the project buildable before the BOM is locked.

FPGA

Programmable logic

HDL blocks, timing constraints, clock-domain crossing checks, external memory paths, deterministic IO, and capture pipelines.

MCU

Embedded control

Bring-up for microcontrollers, secure elements, NFC, CAN, Ethernet, Bluetooth, Matter, and low-power control boards.

ANA

Precision signals

Op-amps, ADCs, DACs, isolation, clocks, references, sensor front ends, and mixed-signal noise checks.

PWR

Power stages

MOSFETs, drivers, PMICs, regulators, SiC/GaN candidates, magnetics, protection, and thermal behavior.

Custom and on-demand designs

Design help when off-the-shelf is not enough.

We design practical electronics around the parts that matter: prototype boards, FPGA logic, power paths, sensor interfaces, and measurement fixtures.

SCH

Schematic and architecture

Circuit architecture, component selection, risk review, test point planning, and revision strategy before layout begins.

PCB

Prototype boards

Compact PCB design guidance for embedded, analog, power, sensor, connector, and FPGA-adjacent electronics.

ODD

On-demand engineering

Focused support for stuck designs: part substitution, signal checks, FPGA feasibility, interface debugging, and redesigns.

Representative FPGA work

FPGA-heavy prototypes and design blocks.

These examples show the type of work we can support with component decisions: logic design, high-speed interfaces, mixed-signal capture, power validation, and production-oriented notes.

FPGA-DAQ

Multi-channel acquisition core

Synchronized ADC sampling, timestamping, buffering, and USB/Ethernet streaming for compact measurement devices.

FPGA fabric / ADC front end / timing PLL / host bridge

FPGA-MOTION

Deterministic motor-control IO

Low-latency PWM, encoder capture, fault input handling, and isolated gate-driver evaluation for control prototypes.

PWM logic / quadrature decode / isolation / MOSFET drivers

FPGA-VISION

Camera preprocessing pipeline

Sensor bring-up, parallel video capture, line buffering, pixel transforms, and measurement hooks for edge-vision devices.

MIPI-style IO study / frame buffers / debug probes

FPGA-LINK

Protocol bridge and timing adapter

Bridges between legacy parallel buses, SPI, LVDS-style links, and microcontroller hosts where firmware alone is too slow.

Bus bridge / clock domains / CDC checks / logic analyzer traces

Component selection focus

MCU, FPGA, and connectivity architecture fit

ADC, DAC, op-amp, reference, and isolation tradeoffs

Power topology, MOSFET, driver, PMIC, and thermal margin

Sensor, connector, ESD, magnetics, and mechanical constraints

Availability, second source, lifecycle, and distributor route

Prototype risk, test access, firmware impact, and BOM cost

Decision packet

Every component recommendation explains the tradeoff.

TDS Electronics Lab gives clients a concise engineering packet: candidates, reasons, alternates, risks, and the validation steps needed before a board spin.

Recommended component family and exact candidate parts
Why each part fits the electrical and firmware constraints
Alternates for price, availability, package, and lifecycle risk
Bench validation plan for the risky circuits
BOM notes that help clients buy and build confidently

For clients

Choose parts before they become expensive mistakes.

Send the project goal, current constraints, and the component decisions that are blocking the next prototype step.